SAE GEIASTD0006C

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Requirements for Using Robotic Hot Solder Dip to Replace the Finish on Electronic Piece Parts
standard by SAE International, 10/26/2021

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Description

This standard defines the requirements for fully replacing undesirable surface finishes using robotic hot solder dip. Requirements for qualifying and testing the refinished piece parts are also included. This standard covers the replacement of pure tin and Pb-free tin alloy finishes with SnPb finishes with the intent of subsequent assembly with SnPb solder. This dipping is different from dipping to within some distance of the body for the purposes of solderability; solder dipping for purposes other than full replacement of pure tin and Pb-free tin alloy finishes are beyond the scope of this document. It covers process and testing requirements for robotic dipping process and does not cover semi-automatic or purely manual dipping processes.

Product Details

Published:
10/26/2021
File Size:
1 file , 310 KB